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Universal Journal of Electrical and Electronic Engineering Vol. 5(4), pp. 67 - 74
DOI: 10.13189/ujeee.2017.050401
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An Investigation of Grounding Resistance Estimation of Human Body by Attenuation Coefficient


Jeu-Min Lin *
Department of Electrical Engineering, National Cheng Kung University, Taiwan

ABSTRACT

It is dangerous when human are working in and around the high voltage environments. The safety of personnel in and around electric power the installations has been a prime concern. Specifically, this safety is generally in terms of the allowable touch and step voltages. These voltages are related to the ground resistance of human foot. In order to increase the safety of personnel, a high resistivity surface layer of gravel is normally existed in the substation switchyards or other high voltage areas. The thickness of this layer will affect the calculation of the ground resistance of human foot. Among them, the electromagnetic field factors are also considered in this paper. As a result, the surface layer of gravel can be used to reduce the ground resistance of human foot. The equivalent model of human foot was modeled by the circular plate conductor in the past. This paper investigates the present methods for estimating the ground resistance of human foot and proposes an equivalent model for calculating the ground resistance of human foot. A comparison of the proposed model and present methods is also shown in this paper.

KEYWORDS
Attenuation Coefficient, Step Voltage, Contact Voltage, Body Grounding Resistance, Electromagnetic Field Factor

Cite This Paper in IEEE or APA Citation Styles
(a). IEEE Format:
[1] Jeu-Min Lin , "An Investigation of Grounding Resistance Estimation of Human Body by Attenuation Coefficient," Universal Journal of Electrical and Electronic Engineering, Vol. 5, No. 4, pp. 67 - 74, 2017. DOI: 10.13189/ujeee.2017.050401.

(b). APA Format:
Jeu-Min Lin (2017). An Investigation of Grounding Resistance Estimation of Human Body by Attenuation Coefficient. Universal Journal of Electrical and Electronic Engineering, 5(4), 67 - 74. DOI: 10.13189/ujeee.2017.050401.