Journals Information
Universal Journal of Electrical and Electronic Engineering Vol. 6(5B), pp. 76 - 83
DOI: 10.13189/ujeee.2019.061610
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Effect of Mass Fraction of Ni in Solution on the Microstructure and Sensitivity of Cu/Ni Film as Low-Temperature Sensor
Moh. Toifur *, Azmi Khusnani , Okimustava
Department of Physics Education, Ahmad Dahlan University, Indonesia
ABSTRACT
The purpose of this research is studying microstructure, the resistivity of Cu/Ni film produced by electroplating on the various mass fraction of Ni in the electrolyte. Then the film is tested for its performance as a temperature sensor. The electrolyte solution was made from mixing of NiSO4, NiCl2, H3BO3, and H2O. Plating was conducted on power 1.5 V and 60℃ bath temperature. The results showed deposits containing Ni and NiO. The X-ray diffraction parameters of Ni[111] and NiO[111] such as intensity, d-spacing and grain size on variations of Ni mass fraction in solution followed the parameters diffraction of Cu[111]. The resistivity is contributed by competition between those three diffraction parameters. Testing Cu/Ni films for sensing the temperature of liquid nitrogen (0℃ to -140℃) shows that all samples have exhibited their performance as low-temperature sensors. The temperature has a linear relationship to the output voltage of the sensor with the sensitivity ranging from 0.75麓10-3 V/℃ to 1.05麓10-3 V/℃. The highest sensitivity in accordance to the sample produced from 8.83 g Ni in the electrolyte.
KEYWORDS
Electroplating, Low-Temperature Sensor, Mass Faction of Ni, Microstructure, Sensitivity
Cite This Paper in IEEE or APA Citation Styles
(a). IEEE Format:
[1] Moh. Toifur , Azmi Khusnani , Okimustava , "Effect of Mass Fraction of Ni in Solution on the Microstructure and Sensitivity of Cu/Ni Film as Low-Temperature Sensor," Universal Journal of Electrical and Electronic Engineering, Vol. 6, No. 5B, pp. 76 - 83, 2019. DOI: 10.13189/ujeee.2019.061610.
(b). APA Format:
Moh. Toifur , Azmi Khusnani , Okimustava (2019). Effect of Mass Fraction of Ni in Solution on the Microstructure and Sensitivity of Cu/Ni Film as Low-Temperature Sensor. Universal Journal of Electrical and Electronic Engineering, 6(5B), 76 - 83. DOI: 10.13189/ujeee.2019.061610.